| 摘要 |
A method for forming chips on a wafer includes forming one or more spaces in a substrate to form and to space two or more chips from each other, forming a positive electrode and a negative electrode in each of the chips, cutting one or more cut-off portions through the substrate and communicating with the space of the substrate. A protective layer is applied onto the outer peripheral portion of the substrate and the chips and includes a covering portion engaged into the cut-off portion of the substrate for allowing the substrate and the chips to be completely shielded and protected by the protective layer without further sealing or packaging operations.
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