| 摘要 |
A semiconductor apparatus is provided to efficiently utilize a region under a bump electrode, to reduce the size of a semiconductor chip and to improve the degree of freedom of a wire layout by arranging a pad regardless of a position of the bump electrode. A semiconductor device is formed on a rectangle semiconductor substrate. A first dielectric is formed on the semiconductor substrate to cover the semiconductor device. A pad electrode(10) is formed on the first dielectric. Wire layers(11a,11b) are formed on the first dielectric. The first dielectric is formed on the same layer as the pad electrode. A second dielectric covers the pad electrode and the wire layers. The dielectric has an opening unit(13) on an upper portion of the pad electrode. A rectangle bump electrode(8) is formed on the second dielectric. The bump electrode is electrically connected to the pad electrode through the opening unit. The dimension of the pad electrode is smaller than that of the bump electrode. The bump electrodes are arranged in a first direction along a long edge of the semiconductor substrate. Each bump electrode is arranged so that the long edge of the bump electrode follows a second direction along a short edge of the semiconductor substrate. The wire layers are arranged under the plural arranged bump electrodes. The wire layer is formed along the first direction. |
