FILM FORMATION METHOD, FILM FORMING EQUIPMENT, AND PATTERN FORMATION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a film formation method which can prevent peeling from a substrate of a surface film including a resist film when in liquid immersion exposure.

SOLUTION: The film formation method includes a process to form the surface film composed of a resist film 102 and a protective film 103 etc. covering the resist film 102 in the surface of a wafer W, and a process to form an edge cap film 104 by supplying a forming material of the edge cap film in the boundary portion of at least the periphery portion of the wafer W and the periphery portion of the surface film of the protective film 103 etc.

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