| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve the alignment of different types of patterns formed on a sample to be inspected in a short period of time in a manufacturing apparatus or inspecting device for the sample to be inspected such as wafers or the like. <P>SOLUTION: The pattern inspecting device includes a sample positioning means for disposing the sheet-shaped inspection sample T in such a position that the outer peripheral edges T1 and T3 of the inspection sample T substantially overlap the outer peripheral edges R1 and R3 of a sheet-shaped reference sample R having an outer peripheral edge shape similar to that of the inspection sample T, and a shift measurement means for measuring a shift of the position of an inspection pattern T5 formed on the inspection sample T from the position of a reference pattern R5 formed on the reference sample R, while the outer peripheral edges R1, R3, T1, and T3 of the inspection sample T and the reference sample R are in their overlapping state. <P>COPYRIGHT: (C)2008,JPO&INPIT |
