| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device which stabilizes bonding quality in a wire bonding process and enables the relatively easy manufacturing of the semiconductor device. SOLUTION: The manufacturing method for the semiconductor device includes a step (a) of providing a lead frame 51 having a die pad 1 on which a semiconductor chip 6 is mounted, a frame 3 disposed outside the die pad 1, and a plurality of first leads 4a each having a tip facing the die pad 1, a rear end connecting to the frame 3, and a thin wall 19, and a step (b) of forming a resin pillar 15 on the lower surface of the thin wall 19 of each of the first leads 4a. Following the step (b), an electrode pad disposed on the semiconductor chip 6 is connected to the upper surface of the thin wall 19 of each first lead 4a via a metal thin wire 9, thus executing the wire bonding process. COPYRIGHT: (C)2008,JPO&INPIT |
