| 摘要 |
An electronic apparatus suppressing damages to a device not having high durability to a high voltage of a structure including a first member having a first electrode and a device, and a second member having a second electrode in which the first electrode and the second electrode, are formed in a region not overlapping the device, the first member and the second member are anodically bonded by the application of a voltage between the first electrode and the second electrode and the device is encapsulated between the first member and the second member.
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