发明名称 Assembly comprising a substrate and a chip mounted on the substrate and a method for fabricating the same
摘要 An assembly includes a substrate, a chip mounted on the substrate, a voltage controlled oscillator circuit including an inductor and further circuit elements. The inductor is mounted on or in the substrate, and the further circuit elements are mounted on or in the chip. An assembly is disclosed that includes a substrate including a first metallization plane and a second metallization plane, a chip mounted on the substrate, and an inductor mounted on or in the substrate. The inductor includes a first inductor portion in the first metallization plane and a second inductor portion in the second metallization plane. An assembly is also disclosed including a substrate, a chip mounted onto the substrate, and a transformer formed at least in part on or in the substrate.
申请公布号 US2008130257(A1) 申请公布日期 2008.06.05
申请号 US20060641604 申请日期 2006.12.19
申请人 LI PUMA GIUSEPPE;SEIPPEL DIETOLF 发明人 LI PUMA GIUSEPPE;SEIPPEL DIETOLF
分类号 H05K7/00 主分类号 H05K7/00
代理机构 代理人
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