发明名称 Heat treatment apparatus
摘要 A heat treatment apparatus capable of ensuring a uniform temperature distribution on a substrate and reducing the generation of a sublimate includes a housing, a mounting table being arranged to move up and down within the housing, and a first heater being provided on the mounting table to heat a substrate placed on the mounting table, a second heater is provided on one side of the housing while an exhaust device is provided on the other side of the housing.
申请公布号 US2008128402(A1) 申请公布日期 2008.06.05
申请号 US20070786203 申请日期 2007.04.11
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 SHIMAI FUTOSHI
分类号 F27D11/00 主分类号 F27D11/00
代理机构 代理人
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