摘要 |
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes location of a piezoelectric material as part of a semiconductor sensing structure. The semiconductor sensing structure, in conjunction with the piezoelectric material, can be used as a sensing device to provide an output signal associated with a sensed event. |
申请人 |
ROBERT BOSCH GMBH;METZ, MATTHIAS;PAN, ZHIYU;STARK, BRIAN;ULM, MARKUS;YAMA, GARY |
发明人 |
METZ, MATTHIAS;PAN, ZHIYU;STARK, BRIAN;ULM, MARKUS;YAMA, GARY |