发明名称 CIRCUIT DEVICE EQUIPPED WITH CAPACITOR
摘要 PROBLEM TO BE SOLVED: To provide a circuit device equipped with a capacitor for reducing a pressure in a cover in which a capacitor is housed in the case of packing mold resin. SOLUTION: This circuit device equipped with a capacitor is provided with: a case 1 in which a circuit board mounted with a circuit element is housed; a capacitor 2 electrically connected to the circuit of the circuit board; a cover 3 covering the capacitor to be engaged with the case; and a grommet 4 installed at the opening of the cover for fixing the capacitor in the cover, wherein a part of the capacitor covered with the cover is arranged so as to be projected from the opening formed at the wall part of the case, and a part of the periphery of the opening of the cover is notched, and a part of the grommet is exposed from a notch 31, and when a pressure in the cover exceeds a predetermined value which is less than a cover explosion proof critical value, a gap is formed between the grommet and the cover. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008130908(A) 申请公布日期 2008.06.05
申请号 JP20060315699 申请日期 2006.11.22
申请人 SHINDENGEN ELECTRIC MFG CO LTD 发明人 UEDA KOICHIRO;IGARASHI KOJI
分类号 H01G9/00;H01G9/12 主分类号 H01G9/00
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