发明名称 ELECTRONIC DEVICE CASING AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electronic device casing manufactured in high productivity at a high ratio of qualification and capable of extending the life of the electronic device, and to provide its manufacturing method. SOLUTION: The manufacturing method of the electronic device casing 20 includes a step of preparing a display device 24, a step of preparing an injection-molding mold containing a female mold having a molding vessel and a male mold inserted in the female mold and having the recessed vessel mounted on the attached mold core and having the same dimension and shape as a display device 24, a step of mounting the display device 24 in the recessed vessel of the male mold, a step of inserting the female mold in the female mold so that a cavity having the same dimension and shape as the resin casing 24 is made between the forming vessel and the mold core, a step of injecting a thermoplastic resin in the cavity to shape the resin casing 22 so that the display device 24 and the resin casing 22 are integrated into one body, and a step of cooling the injection-molding mold and then taking out the shaped body. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008126657(A) 申请公布日期 2008.06.05
申请号 JP20070269164 申请日期 2007.10.16
申请人 SHENZHEN FUTAIHONG PRECISION INDUSTRIAL CO LTD;SUTECH TRADING LTD 发明人 GAO JIN-FENG;KYO TETSUGEN;HANSEN KEN-HOLM
分类号 B29C45/14;B29K101/12;B29L31/34;H05K5/02 主分类号 B29C45/14
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