Electronic package for integrated circuit, has shielding layer provided on carrier element e.g. interposer, for electric and magnetic shielding of circuit element e.g. capacitor and coil, of chip

摘要

The package has a chip (2) with a contact element (3) e.g. solder balls or solder bumps, that faces a carrier element e.g. interposer (1). The chip is mounted on the carrier element. A shielding layer (1.1) is provided on the carrier element for electric and magnetic shielding of a circuit element (2.1) e.g. capacitor and coil, of the chip. The capacitor or the coil is provided as a part of a voltage controlled oscillator. The carrier element is connected to a printed circuit board. An independent claim is also included for a method for electric or magnetic shielding of a circuit element.