| 摘要 |
<p>The method involves punching an electrically isolating adhesive layer (9), and applying the adhesive layer on a printed circuit board (2) or on a base plate (3). The circuit board, adhesive layer and plate are joined to a compound structure, where the plate is an aluminum plate, a steel plate or a grey cast iron plate. The adhesive layer is projected in an area of punching edges of the circuit board. The adhesive layer is formed on an acryl base, epoxy base or phenol base. A covering film layer (7) and/or isolation layers of the circuit board are made of polyester, teflon, epoxy or polyimid. An independent claim is also included for an electronic-compound structure comprising an electrically conducting base plate.</p> |
