IMAGE SENSOR PAKAGE OF OPTICAL POINTING DEVICE

摘要

An image sensor package of an optical pointing device is provided to prevent pollution of an image sensor chip by arranging a sealing mold on the image sensor chip and filling a transparent sealant into the sealing mold and hardening the transparent sealant, and stand against external shocks due to vertical load generated by a dome switch. An image sensor package is manufactured by the steps of preparing a printed circuit board(211) having lead terminal groups printed at intervals, wherein the lead terminal groups consist of a center securing part and circumferential lead terminals(207,213); connecting bonding pads(205) of an image sensor chip(201) with the lead terminals by bonding wires(203); molding a transparent sealant(209) integratedly with the printed circuit board to cover the bonding pads of the image sensor chip and the lead terminal groups for packaging; and separating each image sensor package.