| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress the occurrence of slip at the contact part of a holder 1 for heat treatment of a semiconductor wafer. <P>SOLUTION: By forming inclined surface regions A and B in the peripheral parts of convex regions 4a and 4b for supporting the semiconductor wafer, the edges of the peripheral parts of convex regions 4a and 4b are removed. Thus, the holder 1 for heat treatment is not brought into strong contact with the semiconductor wafer, only at a part caused by the line contact between the semiconductor wafer and the holder 1 for heat treatment, so that the occurrence of slip at the contact part between the holder 1 for heat treatment and the semiconductor wafer is suppressed, and the yield can be improved. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
