发明名称 CONDUCTIVE RESIN MOLDING AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a conductive resin molding which is free from the falling-off of ultrafine conductive fibers that constitute the conductive layer and can maintain the initial conductivity at its manufacture for a long period of time, and its manufacturing method. SOLUTION: Provided is a conductive resin molding T in which a conductive layer 2 consisting of ultrafine conductive fibers 2a is formed on the surface of a resin substrate 1 and in which the ultrafine conductive fibers 2a are embedded and fixed in the surface of the resin substrate 1. Its manufacturing method comprises arranging, in an injection molding die or a press molding die, a transfer film formed by coating a release film with a coating liquid having the ultrafine conductive fibers dispersed therein and heating the film, and transferring the conductive layer simultaneously with the molding of the resin substrate to make the ultrafine conductive fibers embedded and fixed. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008126469(A) 申请公布日期 2008.06.05
申请号 JP20060312777 申请日期 2006.11.20
申请人 TAKIRON CO LTD 发明人 TAKASE HIROBUMI;ITO HIDEMI
分类号 B32B5/02;B29C45/14;B29C51/08;B29C51/12;B29L9/00;B32B7/02;H05F1/00;H05F1/02 主分类号 B32B5/02
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