发明名称 Composition and method for enhancing pot life of hydrogen peroxide-containing CMP slurries
摘要 A method for providing CMP slurries for copper CMP that have improved pot life by ameliorating hydrogen peroxide degradation in slurries. The method comprises a composition that has a transition metal content of less than about 5 parts per million (ppm), preferably less than about 2 ppm. Preferably the method comprises a composition containing less than about 2 ppm of yttrium, zirconium, and/or iron.
申请公布号 US2008132071(A1) 申请公布日期 2008.06.05
申请号 US20080011435 申请日期 2008.01.25
申请人 CABOT MICROELECTRONICS CORPORATION 发明人 YUCHUN WANG;LU BIN;PARKER JOHN;MARTIN ROGER
分类号 H01L21/461 主分类号 H01L21/461
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