发明名称 |
ARRANGEMENT FOR SURFACE MOUNTING AN ELECTRICAL COMPONENT BY SOLDERING, AND ELECTRICAL COMPONENT FOR SUCH AN ARRANGEMENT |
摘要 |
An arrangement may include a substrate and an electrical component. The electrical component may include a base made of an insulating material and a plurality of connection terminals. Each connection terminal is connected to a corresponding connection pad of the substrate by means of a spot of solder paste. The arrangement may further include a block interposed between the substrate and the base of the electrical component. The block may be located substantially on the axis of application of a force for actuating the electrical component and may be designed to inhibit deformation of the base. The block may include a spot of solder paste soldered to an associated conducting pad on the substrate.
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申请公布号 |
US2008128255(A1) |
申请公布日期 |
2008.06.05 |
申请号 |
US20070948507 |
申请日期 |
2007.11.30 |
申请人 |
COACTIVE TECHNOLOGIES, INC. |
发明人 |
VILLAIN JEAN-CHRISTOPHE;COUR MICHEL |
分类号 |
H01H13/14 |
主分类号 |
H01H13/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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