| 摘要 |
The present invention provides a method of connecting an integrated circuit to a substrate and a corresponding circuit arrangement. Connecting occurs by performing the steps of: providing a main area (HF 1 ) of the integrated circuit ( 1 ), which has an electrical contacting region ( 2 ), with a mechanical supporting structure ( 3 a , 3 b ; 33 a , 33 b , 33 c ; 43 a , 43 b , 43 c); providing a solderable surface region ( 5 a , 5 b ; 35 a , 35 b , 35 c ; 60 a , 60 b , 60 c) of the mechanical supporting structure ( 3 a , 3 b ; 33 a , 33 b , 33 c ; 43 a , 43 b , 43 c); providing a solderable terminal region ( 10; 5, 30; 40, 50 ), which is electrically connected to the electrical contacting region ( 2 ), on the main area (HF 1 ) of the integrated circuit ( 1 ); providing a main area (HF 2 ) of the substrate ( 20 ) with a first soldering region ( 22', 23'; 22', 23', 22'', 23'' ), which can be aligned with the solderable surface regions ( 5 a , 5 b ; 35 a , 35 b , 35 c ; 60 a , 60 b , 60 c), and with a second soldering region ( 22, 23 ), which can be aligned with the solderable terminal region ( 10; 5, 30; 40, 50 ); and simultaneous soldering of the surface regions ( 5 a , 5 b ; 35 a , 35 b , 35 c ; 60 a , 60 b , 60 c) to the first soldering region ( 22', 23'; 22', 23', 22'', 23'' ) and of the terminal region ( 10; 5, 30; 40, 50 ) to the second soldering region ( 22, 23 ). |
