| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate having built-in components for enhancing side-face shield effect and promoting miniaturization of the substrate, by utilizing the mounting area of an electronic part efficiently. <P>SOLUTION: The substrate having built-in components 10 includes a wiring substrate 11 containing a first insulating layer 13, a plurality of electronic parts 12 which is built in the first insulating layer 13, and a first grounding electrode 16 prepared on the upper face of the wiring substrate 11, namely on the upper face of the fist insulating layer 13. In addition, the component built-in substrate 10 includes a shield electrode of a barred lattice shape made of two or more non-through via holes 20, of which base end portions are connected electrically to the first grounding electrode 16 and which are arranged in the first insulating layer 13 in a way that they are not passed through the first insulating layer 13. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
