发明名称 THERMAL POWER GENERATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a thermal power generating device having flexibility in which densification of a thermocouple can be achieved, whereby the thermocouple can be easily mounted on a curved surface. SOLUTION: The thermal power generating device 1 includes: an insulation sheet 2 that has flexibility, the sheet 2 comprising a plurality of formation regions 21 where the thermocouple is formed and a plurality of non-formation regions 20A and 20B where the thermocouple is not formed; a plurality of the thermocouples that is formed each on the plurality of the formation regions 21 in the insulation sheet 2, wherein the thermocouples are connected in series; and a connection pattern, which is formed on the non-formation regions 20A and 20B in the insulation sheet 2, for connecting in series the plurality of thermocouple each formed on the plurality of the formation regions 21. The plurality of the thermocouples includes: a plurality of p-type semiconductor patterns 5A formed on the surface 2a of the insulation sheet 2; a plurality of n-type semiconductor patterns 5B formed on the backside 2b of the insulation sheet 2; and a plurality of through hole platings 6b that penetrates through the insulation sheet 2 to alternately connect the p-type semiconductor pattern 5A and the n-type semiconductor pattern 5B. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008130813(A) 申请公布日期 2008.06.05
申请号 JP20060314211 申请日期 2006.11.21
申请人 TOKAI RIKA CO LTD;RITSUMEIKAN 发明人 TANAKA KENJI;UENO HIROSHI;WATABE MASAKI;SUGIYAMA SUSUMU
分类号 H01L35/32;H01L35/16;H01L35/34;H02N11/00 主分类号 H01L35/32
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