| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching method and an etching device, wherein a glass substrate or the like can be subjected to etching with high precision, and the necessity of maintenance can be reduced. SOLUTION: A circulation line 30 where, from an etching tank 10 in which the member to be treated is dipped into an etching liquid and is subjected to etching treatment, the etching liquid is discharged and is circulated is formed. Then, the etching liquid flowing through the circulation line 30 is introduced into a filtering tank 20 provided with a dipping membrane 21 and is subjected to suction filtering by the dipping membrane 21, and the filtrate from which SS (suspended solids) are removed is returned to the circulation line 30. COPYRIGHT: (C)2008,JPO&INPIT
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