发明名称 |
Intergrated Circuits Device Having a Reinforcement Structure |
摘要 |
An integrated circuit device comprises a substrate, a stack structure including circuit structure having conductive lines positioned on the substrate, a reinforcement structure including at least one supporting member positioned on the substrate and a roof covering the circuit structure and the supporting member and at least one bonding pad positioned on the roof and electrically connected to the conductive lines. A method for preparing an integrated circuit device comprises forming a stack structure including circuit structure having conductive lines on a substrate, forming a reinforcement structure including at least one supporting member on the substrate and a roof covering the supporting member and the circuit structure and forming at least one bonding pad on the roof and electrically connecting to the conductive lines.
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申请公布号 |
US2008128892(A1) |
申请公布日期 |
2008.06.05 |
申请号 |
US20060566160 |
申请日期 |
2006.12.01 |
申请人 |
PROMOS TECHNOLOGIES, INC. |
发明人 |
WU HSIAO CHE;TSAI YU MIN;TSAI WEN LI |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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