发明名称 |
SEMICONDUCTOR STRUCTURE WITH LINER |
摘要 |
A semiconductor structure and methods of making the same. The semiconductor structure includes an interconnect feature substantially filled with a conductive material and disposed within a first dielectric material, and a second dielectric material comprising a contact via over the interconnect feature. The semiconductor structure further includes a gouging feature in the conductive material and adjacent to the contact via, and a first liner material deposited substantially only on surfaces of the conductive material in the gouging feature.
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申请公布号 |
US2008128907(A1) |
申请公布日期 |
2008.06.05 |
申请号 |
US20060565810 |
申请日期 |
2006.12.01 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
YANG CHIH-CHAO;WANG PING-CHUAN |
分类号 |
H01L23/52;H01L21/4763 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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