| 摘要 |
This invention provides a joining method which can easily manufacture a microchip by merely joining substrates to each other by taking advantage of a hydrophilic film on a fine flow passage in its internal face. The joining method comprises the following steps. A coating solution (12), which is converted to SiO<SUB>2</SUB> upon curing, is coated onto a microchip substrate (10), with a fine flow passage (11) formed therein, on its fine flow passage (11) formed side. On the other hand, a coating solution (21), which is converted to SiO<SUB>2</SUB> upon curing, is coated onto a flat plate-shaped microchip substrate (20) on its side to which the microchip substrate (10) is to be joined. The microchip substrates (10, 20) are superimposed on top of each other so that the microchip substrate (10) on its fine flow passage (11) side coated with the coating solution (12) faces the microchip substrate (20) on its coating solution (21) coated side. The coating solutions (12, 21) are then cured and are converted to SiO<SUB>2</SUB> films (13, 22), whereby the microchip substrates (10, 20) are joined to each other. |
