| 摘要 |
A multi chip package is provided to reduce the length of a bonded wire and the number of the bonded wires by electrically connecting a semiconductor chip to a printed circuit board with one wire. An electrode terminal is formed on a surface of a printed circuit board(100). An edge pad-type first semiconductor chip(104) is attached to a surface of the printed circuit board. A metal wire(106) electrically connects a bonding pad of the first semiconductor chip to the electrode terminal of the printed circuit board. A second semiconductor chip(114) is arranged on the first semiconductor chip in a flip chip manner. A bump(110) connects the first semiconductor chip to the second semiconductor chip. A filling material(116) is filled in a space between the first semiconductor chip and the second semiconductor chip. An encapsulant(118) encapsulates an upper surface of the printed circuit board including the metal wire, the first semiconductor chip, and the second semiconductor chip. A mounting member is attached to the other surface of the printed circuit board. |
