| 摘要 |
<P>PROBLEM TO BE SOLVED: To form a semiconductor chip with a side electrode while securing quality thereof through an inspection by probing in a wafer level. <P>SOLUTION: A metal-filled electrode 27 is formed so that it is disposed to extend over adjacent each circuit region 14 and electrically connected to each circuit region 14. After the metal-filled electrode 27 is formed, a semiconductor wafer is cut along cutting lines 21 present between adjacent each circuit region 14, and a side electrode 31 is formed to the semiconductor chip. After the semiconductor wafer is cut, each semiconductor chip 11 is inspected by probing, thus the semiconductor chip with a side electrode being manufactured. <P>COPYRIGHT: (C)2008,JPO&INPIT |
