发明名称 POSITIVE RESIST MATERIAL AND PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a resist material having very high resolution in an ArF lithography technique and providing a pattern with good faithfulness to a pattern and small LER. <P>SOLUTION: The positive resist material contains: a resin component (A) which becomes soluble in an alkali developer under the action of an acid; and a compound (B) which generates an acid in response to an actinic ray or radiation, wherein the resin component (A) is a high molecular compound having a repeating unit represented by a general formula (1) and the compound (B) which generates the acid is a sulfonium salt compound comprising a fluorine-containing sulfonate, wherein R<SP>1</SP>is H or methyl; R<SP>2</SP>is a fluorine-containing substituent; n is 1 or 2; a, b, c and d are each 0.01 and less than 1; and a+b+c+d=1. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008129399(A) 申请公布日期 2008.06.05
申请号 JP20060315413 申请日期 2006.11.22
申请人 SHIN ETSU CHEM CO LTD 发明人 TANAKA YOSHIO;SEKI AKIHIRO;TAKEMURA KATSUYA;NISHI TSUNEHIRO
分类号 G03F7/039;C08F220/28;G03F7/38;H01L21/027 主分类号 G03F7/039
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