| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-luminance semiconductor light-emitting device that allows lamination of light-emitting elements having the same size, has no regulation by size, and allows mounting of the light-emitting elements in less area. <P>SOLUTION: The semiconductor light-emitting device 1 is composed by laminatedly mounting transparent light-emitting elements 3, 4 and 5 having the same size on an electric substrate 2 by using wire-bonding. The light-emitting element 4 is laminated on the light-emitting element 3, which includes bonding wires 8, 9 connected to a bonding pad of the light-emitting element 3, via a transparent resin layer 6. The light-emitting element 5 is laminated on the light-emitting element 4 in the same state as the light-emitting element 4. Each emitted light of the light-emitting elements 3, 4 transmits through the light-emitting element above each light-emitting element. A face 10 to be irradiated is directly irradiated with emitted light of the light-emitting element 5. <P>COPYRIGHT: (C)2008,JPO&INPIT |
