| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow device capable of reducing variations in temperature distribution of the surface of a substrate and reducing thermal load to the substrate and components to be mounted, even when executing reflow soldering using a solder having a comparatively high melting temperature such as a lead-free solder. SOLUTION: The reflow device 10 has a carrying means 22 for carrying a substrate 20 having a component 60 mounted thereon; a heating section 14 for pre-heating the substrate 20, and then, reflow-soldering the substrate; and a cooler 16 for cooling the substrate 20 subjected to reflow soldering. The carrying means 22 is provided with a work placing section 34 having a resin sheet 36 laid on a placing surface 34a used for placing the substrate 20. Further, the heating section 14 is provided with a heating plate section 38 for heating the bottom of the work placing section 34, and the cooling section 16 is provided with a cooling plate section 50 for cooling the bottom of the work placing section 34. COPYRIGHT: (C)2008,JPO&INPIT |
