| 摘要 |
PROBLEM TO BE SOLVED: To provide a registration method for a wafer electrode and an alignment method for a wafer capable of improving the reliability of wafer processing, such as inspection, and reducing the load of operator, by releasing the operator from each operation for reference pattern selecting and pattern matching. SOLUTION: The alignment method for wafer is provided with a process of imaging an arbitrary scribe line of a wafer W on a placement table 11 by a first CCD camera 14 and registering its position; a process of recognizing an electrode pad of a chip which is in a predetermined positional relation with the registration position of the scribe line under illuminance in which an edge line E of an chip image P appears by a first CCD camera 14, and registering the illuminance and the size of the chip image; a process of registering coordinates of the placement table 11 when the electrode pad is recognized by the first CCD camera 14; and a process of performing the alignment of the electrode pad where the coordinates are registered. COPYRIGHT: (C)2008,JPO&INPIT
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