| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a memory card package structure and a production method thereof. <P>SOLUTION: The package structure 7' of a memory card includes a Printed Circuit Board (PCB) 5 and at least one chip package 4. Plural solder pads are set on the upper surface of the PCB 5, and an exposed golden finger 54 is set on the bottom surface of the PCB. Every chip package includes at least one chip and a substrate. At least one layer of trace is set inside the substrate, and the trace has plural conductive terminals exposed on the bottom surface of the substrate. The conductive terminals are adhered to and electrically connected with the solder pads. A package method for a memory card includes: providing at least one chip package 4 using a substrate as a chip carrier; adhering the chip package 4 onto a PCB 5 to electrically connect the chip package 4 and the PCB 5; and covering the chip package 4 and the PCB 5. <P>COPYRIGHT: (C)2008,JPO&INPIT |
