| 摘要 |
PROBLEM TO BE SOLVED: To provide a cured product of an epoxy resin excellent in any of flame retardancy, heat resistance and the adhesion to a metal foil without using a halogen-containing retardant and to provide a prepreg, a metal-clad laminate, a printed wiring board and a multilayer printed wiring board. SOLUTION: An epoxy resin composition is used, which comprises (A) a polyfunctional epoxy resin, (B) a polyfunctional phenol curing agent containing no nitrogen, (C) a curing agent containing nitrogen, (D) aluminum hydroxide and (E) an inorganic filler having a weight loss at 500°C of not more than 5% wherein the component (A) has an epoxy equivalent of not less than 240 and/or the component (B) has a hydroxyl equivalent of not less than 170; and the component (E) is contained in an amount of not less than 20 mass% based on the total amount of the component (D) and the component (E). COPYRIGHT: (C)2008,JPO&INPIT |
