| 摘要 |
PROBLEM TO BE SOLVED: To securely fix conductive legs to external electrodes of a chip-type multilayer capacitor so that the conductive legs are aligned three-dimensionally, thereby enhancing the quality and accuracy at the time of mounting the chip-type multilayer capacitor on an electronic substrate. SOLUTION: Firstly, cutouts are formed in a metal plate M so that two rows of tongue portions 11 are arranged and their free end portions 12 in the two rows are opposed to each other in order to form a first precursor 10 having a locking portion at each free end portion. After that, each tongue portion is bent at its middle portion to form a second precursor 20 with conductive precursor legs 21 each of which has a free end portion standing up from the metal plate. Next, a chip-type multilayer capacitor 50 is placed between each pair of conductive precursor legs, and the chip-type multilayer capacitor and the conductive legs are joined to each other through a joining means. Subsequently, frame portions F that are left when the cutouts are formed are separated from the conductive precursor legs. Thus, multilayer capacitors with conductive legs, each of which has conductive legs 4 that have an L-shaped side and are securely fixed to the external electrodes, are obtained. COPYRIGHT: (C)2008,JPO&INPIT
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