| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection structure for connecting substrates which can reinforce grounding and improve the performance of the substrates as a set by making a heat slinger also serve for a substrate support to reduce a cost and save space and by grounding the main substrate and the auxiliary substrate via the heat slinger. SOLUTION: The connection structure for connecting substrates is for connecting the main substrate 1 and the auxiliary substrate 5 disposed above the main substrate 1. The main substrate 1 is mounted with a heating component 2, and the heating component 2 is attached with the heat slinger 3. In the connection structure, the heat slinger 3 is attached by a screw 4 to the heating component 2 mounted on the main substrate 1. An upper part of the heat slinger 3 is bent horizontally and the auxiliary substrate 5 is mounted and fixed by another screw 4 on the horizontal portion 3a of the heat slinger 3. The main substrate 1 is formed with a ground 6 in contact with the heat slinger 3 and the auxiliary substrate 5 is formed with a ground 7 in contact with the horizontal portion 3a of the heat slinger 3 to make radiation such as noise generated from ICs, etc. mounted on the substrates 1 and 5 escape to the grounds 6 and 7. COPYRIGHT: (C)2008,JPO&INPIT
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