发明名称 |
VERFAHREN UND VORRICHTUNG ZUM TRENNEN NICHTMETALLISCHER MATERIALIEN |
摘要 |
<p>A method and apparatus for splitting non-metallic substrates includes a laser for generating a laser beam. An integrated cracking devices receives the laser beam and directs the laser beam onto a non-metallic substrate to define the heat affected zone and quench the substrate at a quenching region contained within the heat affected zone. This integrated cracking device includes a housing and optics fitted within the housing for receiving and directing the laser beam onto the substrate. A quenching nozzle is mounted on the housing for quenching the substrate at a quenching region defined within the heat affected zone.</p> |
申请公布号 |
DE60038692(D1) |
申请公布日期 |
2008.06.05 |
申请号 |
DE2000638692 |
申请日期 |
2000.11.22 |
申请人 |
APPLIED PHOTONICS INC. |
发明人 |
HOEKSTRA, BRIAN;FLANNIGAN, ROGER;WEGERIF, DAVID |
分类号 |
B23K26/40;B28D5/00;B23K26/00;B23K26/06;B23K26/14;C03B33/033;C03B33/09;C03B33/10 |
主分类号 |
B23K26/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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