Semiconductor component manufacturing method, involves pivoting and/or tilting and/or rotating sensors relative to each other with plane under bending deformation of area, where sensors are displaced parallel to each other with plane

摘要

The method involves providing a semiconductor chip (3), which extends in a plane, and integrating sensors (4) in the chip with a distance to each other. A cross-section of the chip is selected in a deformation area of the chip in such a manner that the deformation area is deformable in a bending manner, where the deformation area is arranged between the sensors. The sensors are pivotable and/or tiltable and/or rotatable relative to each other with the plane under bending deformation of the deformation area, where the sensors are displaced parallel to each other with the plane.