| 摘要 |
A semiconductor package and a method for manufacturing the same are provided to block the inflow of foreign materials and to improve productivity dramatically by directly attaching an IR(InfraRed) filter on a wafer surface. An image sensor(111) having pad electrodes(107) is arranged on a wafer(101) in a matrix form. An IR filter(125) is connected to a transparent plate having a shape and a size identical to those of the wafer though a tie-bar(127), and attached onto the wafer by an adhesive agent, thereby being mounted on the image sensor. A bump electrode(141) is connected to the pad electrode that is exposed between the tie-bars. The tie-bar has an X-shape and connects edges of the IR filter to each other, thereby exposing the pad electrodes instead of covering them. A perforated line is formed on the middle of the tie-bar. The adhesive agent is coated on a surface opposite to an IR coated surface of the IR filter in an opened curve form.
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