发明名称 |
ELECTROPLATING METHOD FOR COATING A SUBSTRATE SURFACE WITH A METAL |
摘要 |
The object of the present invention is a method of coating a surface of a substrate with copper by electroplating. According to the invention, this method comprises: a step during which the said surface to be coated is brought into contact with an electroplating bath while the said surface is not under electrical bias; a step of forming the coating during which the said surface is biased; a step during which the said surface is separated from the electroplating bath while it is under electrical bias; the aforementioned electroplating bath comprising, in solution in a solvent: a source of copper ions, with a concentration of between 0.4 and 40 mM; and at least one copper complexing agent. |
申请公布号 |
EP1927129(A2) |
申请公布日期 |
2008.06.04 |
申请号 |
EP20060831204 |
申请日期 |
2006.09.20 |
申请人 |
ALCHIMER |
发明人 |
MONCHOIX, HERVE;RAYNAL, FREDERIC;DAVIOT, JEROME;GONZALEZ, JOSE |
分类号 |
H01L21/288 |
主分类号 |
H01L21/288 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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