Electronic assembly including multiple substrates

摘要

An electronic assembly (100) includes a first substrate (102) and a second substrate (122). The first substrate (102) includes a first surface having a first plurality of conductive traces (106) formed on an electrically non-conductive layer (104). The second substrate (122) includes a first surface having a second plurality of conductive traces (126) formed thereon and a second surface having a third plurality of conductive traces (124) formed thereon. A first electronic component (132) is electrically coupled to one or more of the plurality of conductive traces (126) on the first surface of the second substrate (122). At least one of a plurality of conductive interconnects (108) is incorporated within each solder joint that electrically couples one or more of the conductive traces (124) formed on the second surface of the second substrate (122) to one or more of the conductive traces (106) formed on the first substrate (102).