发明名称 |
LOW THERMAL RESISTANCE POWER MODULE ASSEMBLY |
摘要 |
A power module assembly with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate with passageways or openings for coolant that extend through the plate from a lower surface to an upper surface. A circuit substrate is provided and positioned on the spreader plate to cover the coolant passageways. The circuit substrate includes a bonding layer configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer may be solder material which bonds to the upper surface of the plate to provide a continuous seal around the upper edge of each opening in the plate. The assembly includes power modules mounted on the circuit substrate on a surface opposite the bonding layer. The power modules are positioned over or proximal to the coolant passageways. |
申请公布号 |
EP1842408(A4) |
申请公布日期 |
2008.06.04 |
申请号 |
EP20050858240 |
申请日期 |
2005.10.18 |
申请人 |
MIDWEST RESEARCH INSTITUTE |
发明人 |
HASSANI, VAHAB;VLAHINOS, ANDREAS;BHARATHAN, DESIKAN |
分类号 |
H01L23/367;H01L23/473;H01L25/07 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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