| 摘要 |
<p>A light emitting device comprising a LED chip, a heat transfer plate on which the LED chip is mounted, a sub mount member disposed between the LED chip and the heat transfer plate, an insulative substrate stacked on the heat transfer plate and having a through hole for exposing the sub mount member, a sealing part sealing the LED chip, and a lens stackingly disposed on the sealing part. The sub mount member comprises a reflecting film reflecting light radiated from the side faces of the LED chip around the joined portion of the LED chip. The thickness of the sub mount member is set so that the surface of the reflecting film can be separated from the heat transfer plate more than the surface of the insulative substrate.</p> |
