| 摘要 |
<p>A transfer system for processing semiconductor materials is provided to solve the problem of considerably decreasing a semiconductor manufacturing yield due to the excessive time required to transfer wafers because the wafer transferring process includes several steps of passing in turn through a load port, a front end module, a load lock chamber, and a process chamber. A transfer system for processing semiconductor materials includes a stage(10) which is installed near at an opening of a main body frame in order to transfer a FOUP(front opening unified pod). The stage includes an upper plate(11), a middle plate(13) and a lower plate(14). The middle plate is coupled with a lower end of the upper plate to which the FOUP is installed. The middle plate also includes the first transferring means for moving the upper plate forwardly or backwardly. The lower plate is coupled with a lower end of the middle plate. The lower plate includes the second transferring means for moving the middle plate forwardly or backwardly. In the output process of the FOUP, the upper and middle plates go ahead to the maximum stroke by the first and second transferring means.</p> |
