发明名称 |
Arrangement for surface mounting an electrical component by soldering, and electrical component for such an arrangement |
摘要 |
<p>The invention provides an arrangement comprising a substrate (12) and an electrical component (14) which comprises a base (20) made of insulating material and connection terminals (40), each of which is connected to a connection pad (18) of the substrate (12) by means of a spot (60) of solder paste, characterized in that it includes a block (62) which is interposed between the substrate (12) and the base (20) of the component, which block is located substantially on the axis (A-A) of application of the force (F) for actuating the component, in order to avoid deformation of the base (20), and consists of a spot of solder paste soldered to an associated conducting pad (64) on the substrate (12).
Application to the mounting of a push-button electrical switch.</p> |
申请公布号 |
EP1928008(A1) |
申请公布日期 |
2008.06.04 |
申请号 |
EP20070121845 |
申请日期 |
2007.11.29 |
申请人 |
COACTIVE TECHNOLOGIES, INC. |
发明人 |
VILLAIN, JEAN-CHRISTOPHE;COUR, MICHEL |
分类号 |
H01H13/48;H05K3/30 |
主分类号 |
H01H13/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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