发明名称 Circuit pattern forming method, circuit pattern forming device and printed circuit board
摘要 <p>A circuit pattern forming method is provided which can reduce a possibility of undesired short-circuits being produced in the circuit by satellites formed when fabricating a conductive pattern and thereby can form a highly reliable printed circuit board. To that end, this invention overlappingly draws a conductive pattern (11) and an insulating pattern (13) of a predetermined thickness by scanning a liquid ejection head and a substrate (10) relative to each other a plurality of times while ejecting droplets of a conductive pattern forming solution (11) and an insulating pattern forming solution (13). When forming the conductive pattern and the insulating pattern that adjoin each other on the substrate, the step of forming the insulating pattern of at least one scan is executed between the conductive pattern forming steps that are executed the plurality of times until the conductive pattern has a predetermined thickness.</p>
申请公布号 EP1737284(A3) 申请公布日期 2008.06.04
申请号 EP20060012739 申请日期 2006.06.21
申请人 CANON KABUSHIKI KAISHA 发明人 FURUKAWA, MASAO;TSURUOKA, YUJI;MORI, TAKASHI;YAMAGUCHI, NOBUHITO;KAMIYA, SEIICHI
分类号 H05K3/12 主分类号 H05K3/12
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