| 摘要 |
<p>To provide a CMP conditioner that prevents dissolution of metals in slurry, without the chipping of the abrasive grains and/or decreasing the cutting performance. [Issues to be solved by the invention] The CMP apparatus has a polishing pad that faces and contacts conditioning surface 2 of the conditioner body 1. On this conditioning surface 2, abrasive grains 3 are distributed and fixed to form abrasive grain layer 5, thus forming the CMP conditioner. The conditioner body 1 is made of ceramics, the abrasive grains 3 in the abrasive grain layer 5 are held by binding phase 4 made of low temperature co-fired ceramics.</p> |
