Cooling device for electronic/electrical components

摘要

The cooling device includes a plate (1) on which the components (2) are mounted so as to allow heat conduction. A flow channel (3) through which a cooling fluid flows is in thermal contact with the plate. A substantially closed container (6) is arranged adjoining the flow channel and in thermal contact with it, and accommodates a cooling fluid repository (7) for receiving heat lost from the components. A flow connection (8) is provided between the flow channel and the container for volume-expansion/degassing of the cooling fluid.