SLURRY PROVIDING APPARATUS

摘要

A slurry supply apparatus is provided to polish uniformly a substrate by forming a mixture having a constant ratio of a polishing agent and an additive. A first supply unit(110) supplies a polishing agent to a polishing pad. A second supply unit(120) is controlled independently from the first supply unit in order to supply an additive of a gas state to the polishing pad. The second supply unit includes a flow rate controller(116) for controlling a flow rate of the additive of the gas state. The second supply unit further includes an injection part(128) for injecting the additive of the gas state onto the polishing pad. The second supply unit includes a receptacle(121) for receiving an additive of a liquid state, an evaporation member(123) for evaporating the additive, and a carrier gas supply part(125) for migrating the evaporated additive onto the polishing pad.