| 摘要 |
<p>Provided are an alkaline etching solution capable of improving a surface roughness even with a relatively low alkaline concentration, which has been conventionally widely used, an alkaline etching method using the solution, a method of manufacturing a silicon wafer, and further a silicon wafer with its surface roughness improved, obtained through the method.</p><p>The alkaline etching solution according to the present invention is an alkaline aqueous solution containing bromate or an alkaline aqueous solution containing bromate and nitrate.
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