发明名称 Sb-Te ALLOY SINTERING PRODUCT TARGET AND PROCESS FOR PRODUCING THE SAME
摘要 Provided is an Sb-Te alloy sintered compact target using atomized powder consisting of substantially spherical particles of an Sb-Te alloy, wherein the spherical atomized powder consists of particles that were crushed and flattened, and the flattened particles exhibiting a ratio (flatness ratio) of short axis and long axis of 0.6 or less occupy 50% or more of the overall particles. With this Sb-Te alloy sintered compact target, particles exhibiting a long axis orientation aligned within ±45° in a direction that is parallel to the target surface occupy 60% or more of the overall particles. In addition, the oxygen concentration in this Sb-Te alloy sintered compact target is 1500wtppm or less. Thus, the Sb-Te alloy sputtering target structure can be uniformalized and refined, generation of cracks in the sintered target can be inhibited, and generation of arcing during sputtering can be inhibited. Further, surface ruggedness caused by sputter erosion can be reduced in order to obtain a high quality Sb-Te alloy sputtering target.
申请公布号 EP1829985(A4) 申请公布日期 2008.06.04
申请号 EP20050811469 申请日期 2005.11.29
申请人 NIPPON MINING & METALS CO., LTD. 发明人 TAKAHASHI, HIDEYUKI
分类号 C23C14/34;C23C14/35;G11B7/24;G11B7/241;G11B7/242;G11B7/26 主分类号 C23C14/34
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